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		mems packaging hsu,tai-ran by tai-ran husu Series: emis processing series ; no.3 Material type: Text Publisher number: catlaogue.bl.uk Publication details: uk inspec:the institution of electrical engineers , united kingdom 1988 Other title: Availability: Items available for loan: Central Library (1)Call number: 621.381 TAI. Log in to add tags Add to cart (remove)
		Silicon wafer bonding technology : for VLSI and MEMS applications / edited by Subramanian S. Iyer, IBM microelectronics division, Hopewell Junction, USA and Andre J. Auberton-Hervé, SOITEC, France. by Iyer, Subramanian S [editor.] Auberton-Hervé, Andre J [editor.] Institution of Electrical Engineers [editor.] INSPEC. EMIS Group Series: EMIS processing series ; 1 Material type: Text; Format: print ; Literary form: Not fiction ; Audience: Specialized; Publisher: London, United Kingdom : INSPEC, [2002]Copyright date: c2002 Online access: Table of contents only Publisher description Availability: Items available for loan: Central Library (1)Call number: 621.38152 SIL. Log in to add tags Add to cart (remove)

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