Silicon wafer bonding technology : for VLSI and MEMS applications / edited by Subramanian S. Iyer, IBM microelectronics division, Hopewell Junction, USA and Andre J. Auberton-Hervé, SOITEC, France.

Contributor(s):

Material type: Text

TextSeries: EMIS processing series ; 1Publisher: London, United Kingdom : INSPEC, [2002]Copyright date: c2002Description: xxv, 149 pages : illustrations ; 26 cmContent type:

text

Media type:

unmediated

Carrier type:

volume

ISBN:

0852960395

Subject(s):

Genre/Form:

-- Reading book

DDC classification:

621.38152 SIL 22

Online resources:

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Holdings
Item type	Current library	Collection	Call number	Status	Date due	Barcode	Item holds
Book - Borrowing	Central Library First floor	Baccah	621.38152 SIL (Browse shelf(Opens below))	Available		000049521

Total holds: 0

Includes glossary.

Includes appendices.

Includes bibliographical references and index.

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Silicon wafer bonding technology : for VLSI and MEMS applications / edited by Subramanian S. Iyer, IBM microelectronics division, Hopewell Junction, USA and Andre J. Auberton-Hervé, SOITEC, France.

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