Normal view MARC view ISBD view

Silicon wafer bonding technology : for VLSI and MEMS applications / edited by Subramanian S. Iyer, IBM microelectronics division, Hopewell Junction, USA and Andre J. Auberton-Hervé, SOITEC, France. - xxv, 149 pages : illustrations ; 26 cm. - EMIS processing series ; 1 .

Includes glossary. Includes appendices.

Includes bibliographical references and index.

ISBN: 0852960395

Subjects--Topical Terms:
Silicon-on-insulator technology.
Integrated circuits--Very large scale integration.
Microelectromechanical systems.

Subjects--Index Terms:

Index Terms--Genre/Form: --Reading book

Dewey Class. No.: 621.38152 / SIL